From September 24-26, we will be at the SPE Thermoforming Conference, Booth 410/412. This is the premier forum where the newest techniques and the latest trends in machinery, materials, and equipment are unveiled. We will showcase our innovative materials, people, technologies, and processes as well as our collaborative plans aimed at supporting the growing global market.
Due to record rainfall in eastern Pennsylvania this week, one of SEKISUI SPI’s three facilities, the North Campus, in Bloomsburg, PA, sustained minor flooding. Read More
SEKISUI SPI has been forging ahead with continued investment in their Bloomsburg, PA, and Holland, MI, production campuses to support the growing global markets of aviation, mass transit, medical device, heavy equipment, and automation. Read More
SEKISUI Specialty Polymer Innovations, LLC is lighting up aviation interiors with the release of a stunning new material, KYDEX® Lumina™. Read More